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In advanced semiconductor manufacturing, equipment stability and precision are the decisive factors that determine production yield. Leveraging decades of expertise in machine tool applications for the semiconductor industry, CHEVALIER has successfully entered the semiconductor supply chain through its proprietary control interface and smart manufacturing innovations. Our advanced grinding solutions deliver micron-level precision machining for high-value semiconductor components, empowering customers with the accuracy, consistency, and reliability required for next-generation chip production.
In this edition, we spotlight CHEVALIER's flagship grinding solutions and their critical role in advancing the semiconductor ecosystem. From precision carriers to electrostatic chucks (ESCs)—essential fixtures used throughout semiconductor manufacturing—these components serve as the foundation for every precise positioning process that semiconductor manufacturing demands.
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Precision Carriers — SMART-B1224IV
Delivers Greater Precision for Etching Process
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In semiconductor etching processes, the flatness, positioning accuracy, and machining consistency of carriers are essential for stable wafer support and maximizing etching yield. CHEVALIER's SMART-B1224IV High-Intelligence CNC Profile Grinder is engineered to meet these demanding requirements. Equipped with a fourth-axis rotary table and customized control functions, the machine performs fully automated multi-angle grinding in a single setup, significantly reducing positioning errors. Combined with SMART TaskLink+, automatic wheel dressing, and intelligent compensation technology, the SMART-B1224IV enhances machining accuracy and surface quality while shortening cycle time, enabling semiconductor manufacturers to achieve higher yields and greater production efficiency.
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Electrostatic Chucks — FRG-600S Achieves True Surface Flatness
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In semiconductor photolithography, etching, and ion implantation processes, the flatness and surface quality of electrostatic chucks (ESCs) are critical to ensuring stable wafer clamping and process accuracy. Manufactured from hard and brittle ceramic materials such as aluminum oxide and aluminum nitride, ESCs are susceptible to edge chipping and residual stress during conventional grinding, which can compromise wafer holding precision. CHEVALIER's FRG-600S CNC Rotary Surface Grinder is specifically engineered for these demanding applications. Featuring rotary table grinding, ultra-fine incremental feed, and a hydrostatic table, the FRG-600S delivers exceptionally smooth motion, high rigidity, and superior flatness for precision grinding of advanced ceramic materials. Combined with the intuitive SMART iControl graphical interface, operators can easily configure machining parameters, improving productivity, process stability, and consistent manufacturing quality for semiconductor applications.
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Engineering Every Detail. Advancing the Future Together.
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At CHEVALIER, we build more than machine tools—we engineer confidence into every grinding process. Our mission is to help customers minimize manufacturing risk, improve productivity, and maximize yield. Because in the semiconductor industry, the true cost is never machining time—it is the irreversible consequence of process failure.
Guided by our promise, We Shape Your Ideas, CHEVALIER is a trusted technology partner. By understanding our customers' most critical manufacturing challenges, we deliver precision grinding and process solutions that enable innovation with confidence. Every machine we build reflects our commitment to precision, reliability, and long-term partnership, helping customers transform ideas into breakthrough technologies and shape the future of semiconductor manufacturing.
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Chevalier Chevalier
SMART-H/B818/ FSG-12/16ADIV
12/16IV Series Series
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Chevalier Download Chevalier
FRG-S Series APP for more info.
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